Nova Series Air Cooler

NT510

NOVA NT510 LCP PRO BK

A high-performance single-tower air cooler with five 6 mm heatpipes, a blacked-out fin stack, and one R25 LCP PRO 120 mm fan for focused desktop CPU cooling.

Single TowerStructure
5 x 6 mmHeatpipes
1 x R25Fan
157 mmHeight

Single-tower cooling, sharpened with flagship fan hardware. Five heatpipes. One R25 LCP PRO fan. Full-platform mounting.

Thermal Architecture

Designed for sustained high-wattage CPU loads.

NT510 combines a compact black fin stack, bidirectional heatpipe behavior, and high-pressure R25 airflow to move heat out of the socket area with control.
NT510 black single-tower fin stack

Single-Tower Structure

A dense black tower for strong case compatibility.

The single-tower layout keeps the cooler narrow while preserving fin density, giving high airflow access without the footprint of a dual-tower design.
NT510 five heatpipe base structure

5 x 6 mm Heatpipes

Bidirectional heat transfer from the copper base.

Five black-coated heatpipes draw heat from the CPU contact area and distribute it through the tower for lower resistance under broad input loads.
NT510 with R25 LCP PRO fan

R25 LCP PRO Fan

Flagship 120 mm airflow on a single tower.

The included R25 LCP PRO fan uses LCP blades, dual ball bearings, and three PWM profiles to balance high static pressure, airflow, and acoustic control.
Turbo3000 RPM +/-10%
Airflow
131.32 CFM
Pressure
6.55 mm-H2O
Noise
45.56 dBA
Performance2400 RPM +/-10%
Airflow
104.54 CFM
Pressure
4.64 mm-H2O
Noise
39.81 dBA
Hybrid1600 RPM +/-10%
Airflow
70.38 CFM
Pressure
2.15 mm-H2O
Noise
29.6 dBA

Three PWM Profiles

Select the output that fits the thermal load.

Turbo pushes maximum heat removal, Performance balances speed and acoustics, while Hybrid keeps daily loads controlled at a quieter operating point.
NT510 fin insertion structure

Fin Insertion Process

Through-fin and folded-fin reinforcement.

The fin stack uses a through-fin plus folded-fin process to tighten heatpipe contact, improve structural strength, and increase usable dissipation area.
NT510 mounting base and heatpipe contact area

CPU Contact

Micro-convex copper base for new CPU hotspots.

The copper base is shaped to cover modern Intel and AMD heat concentration zones, supporting strong transfer from the processor into the heatpipes.
NT510 multi-platform backplate

Platform Support

Intel and AMD mounting with a simplified backplate.

NT510 supports Intel LGA 115x / 1200 / 1700 / 1851 and AMD AM4 / AM5, with a multi-platform backplate designed to make installation cleaner.

Technical Data

NT510 specification overview.

Model
NOVA NT510 LCP PRO BK
CPU Support
Intel LGA 115x / 1200 / 1700 / 1851, AMD AM4 / AM5
Cooler Dimensions
130 x 71 x 157 mm
Fin Thickness
0.35 mm
Heatpipe Specification
6 mm x 5 heatpipes
Structure
Single tower, black-coated fins and heatpipes
Fan Size
120 x 120 x 25 mm
Fan Quantity
1
Fan Bearing
Dual ball bearing
Weight
160 +/-10 g
Speed
3000 / 2400 / 1600 RPM, +/-10%
Airflow
131.32 / 104.54 / 70.38 CFM
Static Pressure
6.55 / 4.64 / 2.15 mm-H2O
Noise
45.56 / 39.81 / 29.6 dBA
Rated Voltage
12V
Current
490 mA
Power
5.88W
Fan Connector
4-pin PWM
Warranty
5 years